BGA Reballing Stencil – SSD NAND Flash BGA132 BGA152 BGA316

Professional BGA Reballing Stencil for SSD NAND Flash Memory Chips

Achieve precise, repeatable solder ball placement with this high-quality BGA reballing stencil template, purpose-built for SSD NAND Flash memory chip ICs including BGA132, BGA152, and BGA316 packages. Whether you're a professional board-level repair technician or an advanced electronics hobbyist, this positioning solder plate delivers the accuracy needed for reliable chip reballing every time.

Key Features

• Multi-Package Compatibility: Supports BGA132, BGA152, and BGA316 NAND Flash chip footprints — one stencil for multiple chip types.
• Precision-Cut Tin Net: Laser-cut solder apertures ensure consistent solder paste or solder ball alignment for clean, professional results.
• Rigid Positioning Frame: The built-in positioning solder plate holds chips securely during the reballing process, minimising movement and misalignment.
• Durable Construction: Made from high-grade stainless steel for long-lasting performance and resistance to thermal stress during repeated use.
• Optimised for SSD Repair: Specifically designed for computer SSD NAND Flash memory chip reballing — ideal for data recovery and drive repair workflows.
• Compact & Easy to Use: Straightforward setup that fits standard reballing stations and hot air rework systems.

Specifications

• Compatible Chip Packages: BGA132, BGA152, BGA316
• Application: SSD NAND Flash Memory IC Reballing
• Material: Stainless Steel Stencil / Tin Net
• Condition: New
• Quantity: 1 Stencil Template
• Country of Origin: Made in China

What's in the Box?

• 1× BGA Reballing Stencil Template (BGA132 / BGA152 / BGA316)

Perfect For

• SSD board-level repair technicians
• Electronics rework and soldering professionals
• Data recovery labs working with NAND Flash chips
• Advanced DIY electronics repair enthusiasts

Looking for more tools for your electronics repair bench? Check out our Electromagnetic Induction Tester – Coil & Circuit Fault Detector and our Air Compressor Pressure Gauge – DIY Tool to complete your workshop setup.

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Frequently Asked Questions

Q: Which BGA chip packages is this reballing stencil compatible with?

A: This BGA reballing stencil template is compatible with BGA132, BGA152, and BGA316 NAND Flash memory chip IC packages, making it versatile for a range of SSD repair and rework tasks.

Q: What material is the stencil made from?

A: The stencil features a precision laser-cut stainless steel tin net construction, providing excellent durability and resistance to heat during repeated soldering and reballing sessions.

Q: Can this stencil be used with standard reballing stations?

A: Yes. The stencil is designed to fit standard BGA reballing stations and is compatible with hot air rework systems commonly used for NAND Flash chip soldering and replacement.

Q: Is this suitable for beginner electronics repairers?

A: This stencil is best suited for technicians and advanced hobbyists with prior experience in BGA soldering and chip reballing. Proper use of a hot air rework station and soldering skills are recommended for best results.