BGA Reballing Stencil for Samsung S25 Ultra S25+ CPU RAM Chips BGA Reballing Stencil Axl China Mainland

BGA Reballing Stencil for Samsung S25 Ultra S25+ CPU RAM Chips

China Mainland
Sale price  $15.86 Regular price $19.13
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BGA Reballing Stencil for Samsung S25 Ultra S25+ CPU RAM Chips BGA Reballing Stencil Axl China Mainland

BGA Reballing Stencil for Samsung S25 Ultra S25+ CPU RAM Chips

Sale price  $15.86 Regular price $19.13
Ships FromChina Mainland

BGA Reballing Stencil Template for Samsung Galaxy S25 Ultra / S25+ / S25

Precision-engineered for professional phone repair technicians and electronics reworkers, this BGA reballing stencil template is purpose-built for Samsung Galaxy S25 series devices. Designed to support accurate solder ball placement on key chipsets including the SM8750, PM8550VE, PM8550VS, WCN7851, MAX77775P, and SDR875, this stencil ensures clean, consistent results every time.

Whether you're replacing a damaged CPU, RAM chip, or power management IC, this template delivers the precise alignment needed for reliable BGA rework on Samsung S25 Ultra, S25+, and S25 motherboards.

Key Features

  • Compatible Chipsets: SM8750, PM8550VE, PM8550VS, WCN7851, MAX77775P, SDR875
  • Device Compatibility: Samsung Galaxy S25 Ultra (S25+, S25Ultra, SM-S938, SM-S936, SM-S931 series)
  • Stencil Type: BGA (Ball Grid Array) reballing template
  • Application: CPU, RAM, PMIC, RF chip reballing and rework
  • Condition: Brand new
  • Quantity: 1 stencil per order
  • Package Type: SMD-compatible precision template

Who Is This For?

This stencil is ideal for professional mobile phone repair shops, electronics rework labs, and experienced DIY technicians who perform BGA chip-level repairs on Samsung flagship devices. Proper use of a reballing stencil ensures accurate solder ball pitch and spacing, which is critical for successful chip rework.

Made in China

This product is manufactured in Mainland China.

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Frequently Asked Questions

Q: Which Samsung S25 chipsets is this BGA reballing stencil compatible with?

A: This stencil is compatible with the SM8750 (Snapdragon 8 Elite CPU), PM8550VE, PM8550VS (power management ICs), WCN7851 (Wi-Fi/Bluetooth module), MAX77775P (USB-C power delivery IC), and SDR875 (RF modem) as found in the Samsung Galaxy S25, S25+, and S25 Ultra.

Q: Is this stencil suitable for beginners?

A: BGA reballing requires specialized equipment such as a hot air rework station and flux, as well as hands-on experience with chip-level repair. This stencil is recommended for trained technicians or experienced electronics rework professionals to achieve the best results.

Q: How many stencils are included in one order?

A: Each order includes 1 BGA reballing stencil template.

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