BGA Direct Heating Stencil 90x90 – GTX950 GTX960 GM206
BGA Direct Heating Stencil 90x90 – GTX950 GTX960 GM206
BGA Direct Heating Reballing Stencil 90×90mm
Get precise, professional-grade BGA reballing results with this 90×90mm Direct Heating Stencil, purpose-built for NVIDIA GPU chips including the GTX950, GTX960, GTX660, GK106-400-A1, GM206-300-A1, GM206-251-A1, GM206-250-A1, and GM206-150-A1. Engineered for direct heating reballing techniques, this stencil delivers consistent, accurately positioned solder balls every time — an essential tool for GPU board-level repair technicians and electronics rework professionals.
Made in Mainland China.
Key Features
- Chip Compatibility: Designed specifically for GK106-400-A1, GTX950, GTX960, GTX660, GM206-300-A1, GM206-251-A1, GM206-250-A1, and GM206-150-A1 BGA chips
- 90×90mm Size: Standard stencil dimensions for easy use with most reballing stations and fixtures
- Direct Heating Design: Compatible with direct heating reballing methods for faster, more efficient solder ball placement
- High Precision: Laser-cut apertures ensure perfectly aligned solder ball positions, reducing rework errors
- New Condition: Supplied brand new, ready for immediate use
- Quantity: 1 stencil per order
What Is a BGA Reballing Stencil?
A BGA (Ball Grid Array) reballing stencil is a precision tool used during GPU and chip repair to apply fresh solder balls to the underside of a BGA chip. When used with direct heating methods, the stencil is placed directly over the chip while heat is applied, melting the solder balls precisely into position. This process restores reliable electrical connectivity between the chip and the circuit board — a critical step in professional electronics repair.
Who Is This For?
This stencil is ideal for:
- Electronics repair technicians working on NVIDIA GPU boards
- PC hardware repair shops handling graphics card rework
- DIY enthusiasts with BGA reballing experience
- Soldering and rework station operators
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Frequently Asked Questions
Q: Which GPU chips is this BGA direct heating stencil compatible with?
A: This 90×90mm stencil is compatible with the following NVIDIA GPU chips: GK106-400-A1, GTX950, GTX960, GTX660, GM206-300-A1, GM206-251-A1, GM206-250-A1, and GM206-150-A1. Always verify your chip's ball pitch and layout before use.
Q: What reballing method does this stencil support?
A: This stencil is designed for direct heating reballing, where the stencil is placed directly on the BGA chip and heat is applied from above to reflow solder balls into the chip's pads. It is compatible with standard reballing stations and hot air rework equipment.
Q: How many stencils are included per order?
A: Each order includes 1 stencil (90×90mm). If you need multiple units, simply increase the quantity at checkout.
Q: Is this stencil reusable?
A: Yes. With proper cleaning and careful handling after each use, a quality BGA stencil can be reused multiple times. Cleaning off flux residue promptly after each reballing session will help extend the stencil's lifespan.