Amaoe MQ1-6 BGA Reballing Stencil – Qualcomm & MTK IC Tool
Amaoe MQ1-6 BGA Reballing Stencil – Qualcomm & MTK IC Tool
Amaoe MQ1-6 BGA Reballing Stencil for Qualcomm & MTK Chipsets
The Amaoe MQ1-6 BGA Reballing Stencil is a precision-engineered steel mesh tool designed for professional phone board repair technicians. Compatible with a wide range of popular Qualcomm Snapdragon and MediaTek (MTK) chipsets — including SM 8250, 6125, 7150, 7250, 845, 865, MT6885Z, and 6768V — this stencil makes BGA (Ball Grid Array) reballing faster, cleaner, and more accurate than ever.
Made in Mainland China.
Key Features
- Wide Chipset Compatibility: Supports Qualcomm SM 8250, 6125, 7150, 7250, 845, 865, and MTK MT6885Z, 6768V CPU, RAM, and IC chips.
- High-Quality Steel Mesh: Precision laser-cut stencil ensures accurate solder ball placement every time.
- Professional-Grade Tool: Ideal for mobile phone motherboard repair, IC chip reballing, and BGA rework stations.
- Durable & Reusable: Stainless steel construction built to withstand repeated use in demanding repair environments.
- Easy to Use: Designed for both professional technicians and experienced hobbyists working on Qualcomm and MTK-based devices.
- Condition: Brand new, customized stencil — 1 piece per package.
Specifications
- Brand: Amaoe (MQ1-6 Series)
- Type: BGA Reballing Steel Mesh Stencil
- Compatibility: Qualcomm SM 8250 / 6125 / 7150 / 7250 / 845 / 865 | MTK MT6885Z / 6768V
- Application: CPU, RAM, IC Chip BGA Reballing
- Package Contents: 1 × BGA Reballing Stencil
- Origin: Made in Mainland China
Related Products You May Like
- Electromagnetic Induction Tester – Coil & Circuit Fault Detector
- Air Compressor Pressure Gauge 0-10/0-12/0-25 Bar | DIY Tool
Learn more: OSHA guidance on hand and power tools
Frequently Asked Questions
Q: Which chipsets is the Amaoe MQ1-6 BGA Reballing Stencil compatible with?
A: The Amaoe MQ1-6 stencil is compatible with Qualcomm Snapdragon SM 8250, 6125, 7150, 7250, 845, and 865, as well as MediaTek MT6885Z and 6768V CPU, RAM, and IC chips — covering a broad range of popular mobile processors.
Q: Is this stencil suitable for beginners?
A: The MQ1-6 BGA reballing stencil is primarily designed for professional repair technicians and experienced hobbyists familiar with BGA rework and soldering. Beginners should ensure they have basic BGA reballing knowledge and the appropriate rework station equipment before use.
Q: How many stencils are included in the package?
A: Each package includes 1 × Amaoe MQ1-6 BGA Reballing Steel Mesh Stencil. It is brand new and built for repeated professional use.
Q: Is the stencil reusable?
A: Yes. The stainless steel construction makes this BGA stencil highly durable and reusable across multiple reballing sessions, making it a cost-effective addition to any phone repair toolkit.