AMAOE GTX 1080 Ti GP102 Direct Heating BGA Reballing Stencil
AMAOE GTX 1080 Ti GP102 Direct Heating BGA Reballing Stencil
AMAOE GTX 1080 Ti GP102 Direct Heating BGA Reballing Stencil
Precision-engineered for GPU reballing professionals and electronics repair technicians, this AMAOE direct heating BGA stencil is purpose-built for the NVIDIA GTX 1080 Ti GP102 chip series. Whether you're reworking a faulty graphics card or performing a full reballing job, this stencil delivers consistent, accurate solder ball placement every time.
Compatible GPU Models
- GP102-350-K1-A1
- GP102-350-K2-A1
- GP102-350-K3-A1
- GP102-350-K4-A1
- GP102-350-K6-A1
Key Features
- Direct Heating Design: Allows solder paste or solder balls to be applied directly with a hot air station or reflow oven — no separate platform required.
- High-Precision Laser Cut: CNC laser-cut apertures ensure every hole aligns perfectly with the GP102 BGA pad layout for a clean, professional reflow.
- Durable Stainless Steel Construction: Built to withstand repeated use and high-temperature soldering sessions without warping or deforming.
- BGA Package Compatibility: Specifically designed for the BGA (Ball Grid Array) package format used by NVIDIA's GP102 GPU die.
- New Condition: Supplied brand new, ready for immediate professional use.
- Made in Mainland China.
What's in the Box
- 1 × AMAOE GP102 Direct Heating BGA Reballing Stencil
Who Is This For?
This stencil is ideal for GPU repair shops, electronics rework technicians, and advanced hobbyists working on NVIDIA GTX 1080 Ti graphics cards. It streamlines the reballing process, reduces error, and helps restore faulty GPUs to working condition efficiently.
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Frequently Asked Questions
Q: Is this BGA stencil compatible with all GTX 1080 Ti GP102 variants?
A: Yes. This AMAOE direct heating BGA stencil is compatible with GP102-350-K1-A1, GP102-350-K2-A1, GP102-350-K3-A1, GP102-350-K4-A1, and GP102-350-K6-A1 GPU models, covering the full range of NVIDIA GTX 1080 Ti GP102-350 chip variants.
Q: What equipment do I need to use this direct heating BGA stencil?
A: You will need a hot air rework station or a reflow oven, solder balls or solder paste appropriate for BGA reballing, flux, and a steady work surface. The direct heating design means the stencil can be placed directly on the chip without a dedicated reballing platform, making it convenient for bench repairs.
Q: Can this stencil be reused multiple times?
A: Yes. The stencil is constructed from durable stainless steel using precision laser-cut technology, allowing it to withstand multiple high-temperature reballing sessions without warping or loss of aperture accuracy. Proper cleaning after each use will extend its service life.