10th Gen CPU Direct Heating Stencil 90×90 I3 I5 I7 Reballing
10th Gen CPU Direct Heating Stencil 90×90 I3 I5 I7 Reballing
10th Generation CPU Direct Heating Stencil – 90×90mm
Precision-engineered for professional CPU reballing and rework, this 90×90mm direct heating stencil is compatible with Intel 10th Generation processors including I3, I5, and I7 variants (SRGKJ, SRGKK, SRGKL, SRGKG, SRGKF, SRG0N, SRG0S, SRG0V, SRG0U). Whether you're a laptop repair technician or a DIY electronics enthusiast, this stencil makes BGA reballing faster, cleaner, and more consistent than ever.
Key Features
- Direct Heating Design: Allows solder paste to be applied and reflowed directly without a separate frame — saving time and simplifying your workflow.
- 90×90mm Format: Sized perfectly to accommodate 10th Gen Intel CPU footprints for accurate ball placement.
- Wide Compatibility: Supports CPU models SRGKJ, SRGKK, SRGKL, SRGKG, SRGKF, SRG0N, SRG0S, SRG0V, SRG0U across I3, I5, and I7 series.
- High-Precision Laser-Cut Apertures: Ensures uniform solder ball deposition for reliable electrical connections after reballing.
- Durable Stainless Steel Construction: Built to withstand repeated heating cycles without warping or deformation.
- New Condition: Each stencil is supplied brand new for consistent, professional results.
Specifications
- Size: 90 × 90 mm
- Type: Direct Heating BGA Reballing Stencil
- Compatible CPUs: Intel 10th Gen I3 / I5 / I7 — SRGKJ, SRGKK, SRGKL, SRGKG, SRGKF, SRG0N, SRG0S, SRG0V, SRG0U
- Package: SMD
- Quantity: 1 stencil per order
- Condition: New
- Made in: Mainland China
Who Is This For?
This stencil is ideal for laptop repair shops, motherboard rework technicians, and advanced hobbyists who perform BGA chip reballing on Intel 10th Gen processors. It takes the guesswork out of solder ball placement and ensures repeatable, professional-grade results every time.
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Frequently Asked Questions
Q: What CPU models is this 10th Gen direct heating stencil compatible with?
A: This stencil is compatible with Intel 10th Generation I3, I5, and I7 CPUs with the following model numbers: SRGKJ, SRGKK, SRGKL, SRGKG, SRGKF, SRG0N, SRG0S, SRG0V, and SRG0U. Always verify your CPU's exact model number before ordering.
Q: What is a direct heating BGA reballing stencil and how is it used?
A: A direct heating stencil is placed directly over the CPU's BGA pad area. Solder paste or flux is applied through the laser-cut apertures, and the stencil is then heated directly (using a hot air station or infrared heater) to reflow the solder balls onto the chip. This method is faster than using a separate reballing fixture and is widely used by professional repair technicians.
Q: Is this stencil reusable?
A: Yes. The stainless steel construction is designed to handle multiple heating cycles without warping, making it a cost-effective tool for technicians who regularly perform CPU reballing work.
Q: What size is this stencil?
A: The stencil measures 90×90mm, which is sized to fit the BGA footprint of Intel 10th Generation I3, I5, and I7 processors.