SAM19 Reballing Stencil for Samsung S23 & S24 Ultra CPU Chips

$15.95 $19.24

SAM19 Middle Layer Reballing Stencil Template – Samsung S23 & S24 Ultra

Designed for precision BGA reballing work, the SAM19 Middle Layer Reballing Stencil Template is an essential tool for professional phone repair technicians and electronics hobbyists. Compatible with Samsung Galaxy S23 Ultra and S24 Ultra chipsets — including the Snapdragon 8550VS, 58080, WCN7851, P9481UK, and MPB02 — this stencil ensures accurate solder ball placement every time.

Whether you're reballing a CPU, modem IC, or power management chip, this middle-layer stencil provides the exact pitch alignment needed for a reliable, professional-grade repair. Made in Mainland China.

Key Features

Wide Chip Compatibility: Supports Snapdragon 8550VS, 58080, WCN7851, P9481UK, MPB02, and related ICs found in Samsung S23 Ultra and S24 Ultra boards
Middle Layer Design: Precisely engineered stencil openings for accurate solder ball deposition on BGA pads
High-Quality Construction: Laser-cut stainless steel for consistent, repeatable results across multiple reballing jobs
Professional Grade: Ideal for board-level repair shops, independent technicians, and advanced DIY repairers
New Condition: Ships brand new, ready to use straight out of the package
Quantity: 1 stencil template per order

Specifications

Model: SAM19
Type: Middle Layer Reballing Stencil
Compatible Chips: 8550VS, 58080, WCN7851, P9481UK, MPB02
Compatible Devices: Samsung Galaxy S23 Ultra, S24 Ultra
Condition: New
Country of Origin: Made in Mainland China

Frequently Asked Questions

Q: Which Samsung chipsets is the SAM19 reballing stencil template compatible with?

A: The SAM19 middle layer reballing stencil is compatible with the Snapdragon 8550VS, 58080, WCN7851, P9481UK, and MPB02 chips found in the Samsung Galaxy S23 Ultra and S24 Ultra smartphones.

Q: What is a middle layer reballing stencil and how is it used?

A: A middle layer reballing stencil is a precision laser-cut template used during BGA (Ball Grid Array) chip reballing. It is placed over the chip's solder pads to hold solder balls in the correct position before reflowing, ensuring accurate and consistent solder joint formation during board-level phone repairs.

Q: Is this stencil suitable for beginners or only professional technicians?

A: While the SAM19 stencil is primarily designed for professional phone repair technicians and board-level repair shops, advanced DIY repairers with BGA rework experience and the appropriate equipment (hot air station or reflow oven) can also use it successfully.