0.4mm Direct Heating BGA Stencil – BD82HM65/67/76/77
0.4mm Direct Heating BGA Stencil – BD82HM65/67/76/77
Direct Heating BGA Reballing Stencil – 0.4mm Pitch
Get precise, professional-grade BGA reballing results with this 0.4mm direct heating stencil designed for Intel HM-series chipsets. Compatible with a wide range of laptop southbridge and platform controller hub ICs, this stencil is engineered for accurate solder ball placement without the need for a separate paste stencil — simply apply solder balls directly through the openings using a hot air station.
Compatible Chipsets
- BD82HM65 – SLJ4P
- BD82HM67 – SLJ4N
- BD82HM76 – SLJ8E
- BD82HM77 – SLJ8C / SLJTA
- BD82HM70 – SJTNV
Key Features
- 0.4mm ball pitch – precision-cut openings ensure consistent, correctly sized solder balls every time
- Direct heating design – eliminates flux paste mess; balls are held in place and reflowed in one step
- Durable stainless steel construction – resists warping under repeated heat cycles
- Chip-specific template – mapped exactly to the pad layout of the listed Intel HM-series ICs
- Condition: New – ready to use straight out of the package
- Made in Mainland China
What's in the Box?
- 1 × 0.4mm Direct Heating BGA Reballing Stencil
Ideal For
Laptop motherboard repair technicians, electronics rework professionals, and hobbyists who frequently service Intel Sandy Bridge / Ivy Bridge platform chipsets. Pair this stencil with quality solder balls and a hot air rework station for fast, clean chip reballing.
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Frequently Asked Questions
Q: Which Intel chipsets is this BGA reballing stencil compatible with?
A: This 0.4mm direct heating stencil is compatible with the BD82HM65 (SLJ4P), BD82HM67 (SLJ4N), BD82QM67 (SLJ4M), BD82HM76 (SLJ8E), BD82HM77 (SLJ8C / SLJTA), and BD82HM70 (SJTNV) Intel platform controller hub chipsets commonly found in laptop motherboards.
Q: What does "direct heating" mean for a BGA stencil?
A: A direct heating BGA stencil allows you to place solder balls into the stencil openings and reflow them directly onto the chip pads using a hot air station — all in a single step. This method is faster and cleaner than the paste-and-ball approach and is widely preferred by professional motherboard repair technicians.
Q: What pitch size does this stencil use?
A: This stencil features a 0.4mm pitch, which matches the pad spacing of the listed BD82HM/QM series Intel chipsets. Using the correct pitch ensures accurate solder ball alignment and a reliable reflow result.