BGA Reballing Stencil 90×90mm – GK104 & N14E GPU Series
Direct Heating 90×90mm BGA Reballing Stencil – GK104 & N14E-GT Series
Achieve precise, professional-grade BGA chip reballing with this direct heating 90×90mm stencil, compatible with a wide range of GPU chipsets including GK104-325-A2, GK104-355-A2, GK104-200-KA-A2, GK104-225-A2, GK104-425-A2, and N14E-GT-W-A2. Engineered for computer motherboard and GPU repair technicians, this stencil ensures accurate solder ball placement every time.
Key Features
- Universal Compatibility: Fits GK104-325-A2, GK104-355-A2, GK104-200-KA-A2, GK104-225-A2, GK104-425-A2, and N14E-GT-W-A2 chipsets
- 90×90mm Direct Heating Design: Stainless steel construction allows direct heat application for fast, reliable reballing
- High Precision Laser-Cut Holes: Ensures consistent, accurate solder ball placement and alignment
- New Condition: Supplied brand new for optimal performance and longevity
- SMD Package Compatibility: Designed for surface-mount device applications in computer GPU and graphics card repair
- Customizable: Suitable for professional rework stations and DIY repair setups
Product Specifications
| Stencil Size | 90 × 90 mm |
| Compatible Chips | GK104-325-A2, GK104-355-A2, GK104-200-KA-A2, GK104-225-A2, GK104-425-A2, N14E-GT-W-A2 |
| Application | Computer GPU / Graphics Card Reballing |
| Type | Direct Heating BGA Stencil |
| Condition | New |
| Quantity | 1 Stencil |
| Country of Origin | Made in Mainland China |
Who Is This For?
This stencil is ideal for electronics repair technicians, laptop and desktop GPU rework specialists, and hobbyists who need a reliable tool for reballing NVIDIA GK104 and N14E series chips. Whether you're working on a professional rework station or a home repair bench, this direct heating stencil makes the process straightforward and repeatable.
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Frequently Asked Questions
Q: Which GPU chipsets is this BGA reballing stencil compatible with?
A: This direct heating stencil is compatible with GK104-325-A2, GK104-355-A2, GK104-200-KA-A2, GK104-225-A2, GK104-425-A2, and N14E-GT-W-A2 chipsets, commonly found in NVIDIA-based graphics cards and laptop GPUs.
Q: What does "direct heating" mean for a BGA stencil?
A: A direct heating BGA stencil is designed to be placed directly over the chip pad and heated (typically with a hot air station) to melt and deposit solder balls simultaneously. This speeds up the reballing process and helps ensure uniform solder ball placement compared to indirect methods.
Q: What size is this reballing stencil?
A: This stencil measures 90×90mm, making it a standard size compatible with most professional BGA rework station fixtures and holders.
Q: Is this stencil suitable for beginners?
A: While BGA reballing requires some practice and the right equipment (such as a hot air rework station and flux), this stencil's laser-cut precision holes make it easier to achieve consistent results even for those newer to chip-level repair.