90x90 Direct Heat BGA Stencil V810C390 for Intel CPU Reballing
90x90 Direct Heat BGA Stencil V810C390 for Intel CPU Reballing
90x90 Direct Heat BGA Stencil V810C390 – Professional CPU Reballing
Get precision reballing results with this V810C390 Direct Heat BGA Stencil, designed for a wide range of Intel CPU chip IDs including SRD1V, SRGKY, SRFFZ, SRD1W, SRF9W, SRESP, SRESL, SR3N6, and SREJQ. This 90×90 mm stencil is an essential tool for electronics repair technicians and DIY enthusiasts who need consistent, accurate solder ball placement during BGA reballing procedures.
Made in Mainland China.
Why Choose This BGA Stencil?
- Direct Heat Compatible: Designed for direct heat reballing — no need for intermediate carriers or additional fixtures.
- 90×90 mm Format: Standard size for easy compatibility with most reballing stations and jigs.
- Wide CPU Compatibility: Supports SRD1V, SRGKY, SRFFZ, SRD1W, SRF9W, SRESP, SRESL, SR3N6, and SREJQ processor variants.
- Precise Ball Placement: Laser-cut apertures ensure accurate solder ball alignment every time.
- New Condition: Each stencil is brand new and ready to use straight out of the package.
- Durable Construction: Made from high-quality stainless steel for long-lasting performance across multiple uses.
Product Specifications
- Stencil Size: 90 × 90 mm
- Model: V810C390
- Type: Direct Heat BGA Stencil
- Compatible Chips: SRD1V, SRGKY, SRFFZ, SRD1W, SRF9W, SRESP, SRESL, SR3N6, SREJQ
- Condition: New
- Quantity: 1 Stencil
- Application: Computer / Laptop CPU Reballing
- Origin: Mainland China
Who Is This For?
This BGA stencil is ideal for electronics repair shops, laptop technicians, motherboard repair specialists, and hobbyists who perform CPU reballing at home. If you work with Intel-based motherboards and need a reliable, repeatable stencil for solder ball reflow, this tool belongs in your kit.
Looking for more tools to complete your repair setup? Check out our Electromagnetic Induction Tester – Coil & Circuit Fault Detector or the Air Compressor Pressure Gauge – DIY Tool to expand your electronics workbench.
Learn more: OSHA on personal protective equipment
Frequently Asked Questions
Q: What chips is the V810C390 BGA stencil compatible with?
A: This direct heat BGA stencil is compatible with the following Intel CPU chip IDs: SRD1V, SRGKY, SRFFZ, SRD1W, SRF9W, SRESP, SRESL, SR3N6, and SREJQ. Always verify your chip's marking before ordering to ensure the correct stencil fit.
Q: What is direct heat BGA reballing and how does this stencil help?
A: Direct heat BGA reballing is a technique where solder balls are applied to a BGA chip using a stencil placed directly on the chip, with heat applied from above — no intermediate carrier needed. The V810C390 stencil features precision laser-cut apertures that hold solder balls in exact alignment during the reflow process, resulting in consistent, professional-grade results.
Q: What size is this BGA stencil?
A: This stencil measures 90×90 mm, a standard size widely compatible with most reballing stations, jigs, and fixtures used in professional electronics repair.
Q: Is this stencil reusable?
A: Yes. This stencil is made from durable stainless steel and can be cleaned and reused across multiple reballing sessions, making it a cost-effective addition to any repair toolkit.