BGA Stencil 90×90mm for MPC5554MZP132 – Direct Heat Template

$13.20 $15.79

BGA Reballing Stencil Template – 90×90mm for MPC5554MZP132 / MPC5554MZP / MPC5554

Get precise, professional-grade BGA reballing results with this direct-heating stencil template designed specifically for the MPC5554MZP132, MPC5554MZP, and MPC5554 BGA ICs. Whether you're a seasoned electronics technician or an advanced hobbyist, this stencil delivers clean, consistent solder ball placement every time.

Key Features

Direct Heating Design: Compatible with direct-heat reballing stations for fast, accurate solder ball application without the need for a base.
90×90mm Stencil Size: Precisely sized to fit the MPC5554MZP132, MPC5554MZP, and MPC5554 BGA chip footprints.
New Condition: Supplied brand new, ensuring clean apertures and reliable performance from the first use.
SMD Compatible: Designed for Surface Mount Device (SMD) applications, suitable for professional PCB rework and repair workflows.
Customized Apertures: Each stencil is precision-laser-cut to match exact BGA ball grid specifications, ensuring proper solder ball alignment.
Standard Operating Conditions: Built for use across standard operating temperature and power dissipation ranges.
No High-Concern Chemicals: Free from high-concern substances for safer handling during your repair work.

Product Specifications

Compatible ICs: MPC5554MZP132 / MPC5554MZP / MPC5554
Stencil Size: 90 × 90 mm
Type: Direct Heating BGA Reballing Stencil
Package Type: SMD (BGA)
Condition: New
Quantity: 1 Stencil
Country of Origin: Made in China

Who Is This For?

This BGA stencil is ideal for electronics repair professionals, computer board technicians, and advanced DIY enthusiasts who need reliable tools for chip-level rework. It is especially useful for automotive ECU board repairs and embedded computer system servicing that use the MPC5554 processor family.

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Frequently Asked Questions

Q: What chips is this BGA stencil template compatible with?

A: This direct heating BGA stencil template is specifically designed for the MPC5554MZP132, MPC5554MZP, and MPC5554 BGA integrated circuits, making it a precise fit for reballing these chip variants.

Q: What does "direct heating" mean for a BGA stencil?

A: A direct heating BGA stencil is used without a separate support base — it is placed directly over the chip and heated along with the solder balls. This method is faster and suitable for use with most standard reballing stations, providing efficient and accurate ball placement.