BGA Reballing Stencil GK104-325-A2 Direct Heat 90×90mm
BGA Reballing Stencil GK104-325-A2 Direct Heat 90×90mm
BGA Direct Heat Reballing Stencil – GK104-325-A2 Compatible
Achieve precise and reliable GPU reballing with this professional-grade BGA Direct Heat Stencil. Designed for the GK104-325-A2 chip series, this 90×90mm stencil is engineered for exact solder ball placement on compatible NVIDIA GPU chips used in laptops and workstations. Whether you're a seasoned technician or a dedicated hobbyist, this stencil delivers consistent, accurate results every time.
Compatible GPU Models
- N13E-GT-W-A2
- N13E-GTX-A2
- N14E-GTX-A2
- GK104-400-A2
- GK104-200-KD-A2
- GK104-300-KD-A2
Key Features
- Direct Heat Design: Apply solder balls directly without additional jigs — saves time and improves workflow efficiency.
- 90×90mm Size: Perfectly sized to cover GK104-series BGA pads with no overhang or misalignment.
- High-Precision Laser Cut: CNC or laser-etched holes ensure every solder ball lands exactly on the correct pad for a clean reflow joint.
- Durable Stainless Steel Construction: Withstands repeated use and high reflow temperatures without warping or deforming.
- New Condition: Supplied brand new, ready to use straight out of the package.
- SMD Compatible: Suitable for standard SMD soldering and reballing stations.
Specifications
- Application: Computer / GPU Chip Reballing
- Type: BGA Direct Heat Stencil
- Stencil Size: 90 × 90 mm
- Compatible Chips: GK104-325-A2, GK104-400-A2, GK104-200-KD-A2, GK104-300-KD-A2
- Condition: New
- Country of Origin: Made in Mainland China
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Frequently Asked Questions
Q: What GPU chips is the GK104-325-A2 BGA stencil compatible with?
A: This BGA direct heat stencil is compatible with the N13E-GT-W-A2, N13E-GTX-A2, N14E-GTX-A2, GK104-400-A2, GK104-200-KD-A2, and GK104-300-KD-A2 GPU chips commonly found in NVIDIA-based laptop and workstation graphics cards.
Q: What does "direct heat" mean for a BGA reballing stencil?
A: A direct heat BGA stencil is placed directly on top of the chip's BGA pads. Solder balls are loaded into the stencil holes, and heat is applied directly through the stencil — no additional carrier jig is needed. This makes the reballing process faster and simpler for technicians.
Q: What size is this BGA stencil?
A: This stencil measures 90×90mm, making it ideal for covering the full BGA pad array of GK104-series graphics chips without any misalignment.
Q: Is this stencil reusable?
A: Yes. The stencil is constructed from durable stainless steel that withstands high reflow temperatures, making it suitable for multiple reballing sessions without warping or degradation.