BGA Reballing Stencil CXD90064 90×90mm Direct Heating 0.5mm

Q: What chip is this BGA reballing stencil compatible with?

This stencil is specifically designed for the CXD90064GG and CXD90064 BGA chips. The 90×90mm size and 0.5mm ball pitch are matched precisely to this chip's footprint for accurate solder ball placement.

Q: Does this stencil require a stencil holder or fixture?

No — this is a direct heating stencil, which means it can be placed directly onto the chip and heated without a separate holder. This makes it faster and easier to use during BGA reballing operations.

Q: How many stencils are included in one order?

Each order includes 1 stencil. If you need multiple units for high-volume repair work, simply adjust the quantity before adding to your cart.

Q: Where is this stencil made?

This BGA reballing stencil is made in Mainland China.

BGA Reballing Stencil CXD90064 90×90mm Direct Heating 0.5mm

$10.12 $11.93

BGA Reballing Stencil for CXD90064 – 90×90mm Direct Heating, 0.5mm Pitch

This precision direct heating BGA reballing stencil is engineered for the CXD90064GG / CXD90064 chip, making it an essential tool for electronics repair technicians and hobbyists working on computer motherboard rework. With a 0.5mm ball pitch and a 90×90mm footprint, this stencil delivers accurate, consistent solder ball placement every time — no more guesswork during reballing operations.

Designed for direct heating (no holder required), this stencil simplifies your workflow and ensures the solder balls align perfectly with the BGA pads for a reliable, professional-quality result. Whether you're a seasoned repair technician or building your rework toolkit, this stencil is a cost-effective, high-accuracy solution.

Made in Mainland China.

Key Features

Compatible Chip: CXD90064GG / CXD90064
Stencil Size: 90×90mm
Ball Pitch: 0.5mm for high-density BGA reballing
Direct Heating Design: No stencil holder required — place directly on chip and apply heat
Condition: Brand new
Quantity: 1 stencil per order
Application: Computer motherboard BGA chip reballing and rework
Type: Drive IC BGA stencil

Who Is This For?

This BGA stencil is ideal for electronics repair shops, DIY rework enthusiasts, and professional technicians who work on computer boards and need precise solder ball placement for the CXD90064 chip series. Pair it with your BGA rework station and quality solder balls for best results.

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Frequently Asked Questions

Q: What chip is this BGA reballing stencil compatible with?

A: This stencil is specifically designed for the CXD90064GG and CXD90064 BGA chips. The 90×90mm size and 0.5mm ball pitch are matched precisely to this chip's footprint for accurate solder ball placement.

Q: Does this stencil require a stencil holder or fixture?

A: No — this is a direct heating stencil, which means it can be placed directly onto the chip and heated without a separate holder. This makes it faster and easier to use during BGA reballing operations.