BGA Memory Chip K4G80325FB H5GQ8H24MJR – 100% Tested IC
BGA Memory Chip K4G80325FB H5GQ8H24MJR – 100% Tested IC
BGA Memory Chipset – 100% Tested | K4G80325FB / H5GQ8H24MJR
Upgrade or repair your graphics card and electronic hardware with confidence using these fully tested BGA memory chips. Compatible with multiple part numbers — K4G80325FB-HC03, K4G80325FB-HC25, K4G80325FB-HC28, and H5GQ8H24MJR-R0C — each chip is 100% function-tested before dispatch, ensuring reliable performance for general-purpose GPU and system memory applications.
Whether you're a professional electronics repair technician or a hobbyist restoring graphics hardware, these high-density BGA chipsets deliver consistent, dependable results right out of the box.
Key Features
- 100% Tested: Every chip undergoes full functional testing before shipping — zero compromise on quality.
- Multiple Compatible Part Numbers: Covers K4G80325FB-HC03, K4G80325FB-HC25, K4G80325FB-HC28, and H5GQ8H24MJR-R0C in a single listing.
- BGA Package: Industry-standard Ball Grid Array form factor for reliable PCB-level integration.
- General Purpose Use: Suitable for GPU memory replacement, motherboard repair, and electronics rework projects.
- Professional Grade: Ideal for electronics repair shops, component resellers, and skilled DIY enthusiasts.
Specifications
| Part Numbers | K4G80325FB-HC03 / K4G80325FB-HC25 / K4G80325FB-HC28 / H5GQ8H24MJR-R0C |
| Package Type | BGA (Ball Grid Array) |
| Application | General Purpose Memory / GPU Memory |
| Testing | 100% Functional Tested |
| Quantity | 1 Piece |
Made in Mainland China.
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Frequently Asked Questions
Q: What part numbers are compatible with this BGA chipset listing?
A: This listing covers four compatible BGA memory chip part numbers: K4G80325FB-HC03, K4G80325FB-HC25, K4G80325FB-HC28, and H5GQ8H24MJR-R0C. Please verify your board's required part number before ordering to ensure compatibility.
Q: Are these BGA chips tested before shipping?
A: Yes — every chip is 100% functionally tested before dispatch to ensure it meets performance standards and is ready for use in GPU memory replacement or electronics rework applications.
Q: What is a BGA chipset and how is it used?
A: BGA stands for Ball Grid Array — a surface-mount package type used for high-density integrated circuits such as graphics memory chips. These chips are typically soldered onto PCBs using reflow soldering equipment during electronics repair or hardware upgrade projects.