BGA Direct Heating Stencil GDDR5X DDR Memory 90x90mm
BGA Direct Heating Stencil GDDR5X DDR Memory 90x90mm
BGA Direct Heating Stencil for GDDR5X & DDR Memory Chips – 90×90mm
Get precise, professional-grade BGA reballing results with this 90×90mm Direct Heating Stencil, compatible with a wide range of high-performance memory chips including GDDR5X, D9VRL, D9VRK, D9TXS, D9V, and 190F variants. Designed for electronics technicians, repair shops, and hobbyists who demand accuracy when reballing BGA memory on graphics cards, GPUs, and computer motherboards.
Made in Mainland China.
Key Features
- Direct Heating Design: Allows solder to flow directly through the stencil openings for clean, accurate ball placement — no intermediate transfer step required.
- 90×90mm Size: Matches the footprint of common GDDR5X and DDR memory BGA packages for a perfect fit every time.
- Wide Compatibility: Supports D9VRL, D9VRK, D9TXS, D9V, 190F, and related memory chip variants used in graphics cards and computing modules.
- Precision Laser-Cut Apertures: Ensures uniform solder ball deposition for reliable, consistent joints on every reball job.
- Durable Construction: Built to withstand repeated use at standard BGA reballing temperatures without warping or deformation.
- Condition: Brand new, ready for immediate use straight out of the package.
Specifications
- Size: 90mm × 90mm
- Type: Direct Heating BGA Stencil
- Compatible Chips: GDDR5X, D9VRL, D9VRK, D9TXS, D9V, 190F memory ICs
- Application: Computer / GPU / Graphics Card memory reballing
- Package: BGA
- Condition: New
- Country of Origin: Mainland China
Who Is This For?
This stencil is ideal for electronics repair technicians, GPU reball specialists, and advanced DIY enthusiasts who work on graphics card memory repair, motherboard BGA rework, or any application requiring precise solder ball placement on GDDR5X and DDR memory chips.
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Frequently Asked Questions
Q: What memory chips is this BGA direct heating stencil compatible with?
A: This 90×90mm stencil is compatible with GDDR5X, D9VRL, D9VRK, D9TXS, D9V, and 190F BGA memory chip packages commonly found in graphics cards and GPU modules. Always verify your chip's exact BGA footprint before use.
Q: What is the difference between a direct heating stencil and a transfer stencil?
A: A direct heating stencil allows solder paste or solder balls to be deposited and reflowed directly through the stencil while it sits on the chip — no intermediate step is needed. This results in faster workflow and more accurate ball placement compared to traditional transfer-type stencils.
Q: What size solder balls should I use with this stencil?
A: The correct solder ball size depends on the specific aperture dimensions of the target chip. For GDDR5X and DDR memory chips in this category, 0.45mm–0.5mm solder balls are typically used, but always refer to the chip's datasheet to confirm the recommended ball diameter before reballing.
Q: Is this stencil reusable?
A: Yes, with proper cleaning and care after each use, this BGA direct heating stencil can be used multiple times. Avoid excessive mechanical stress or temperatures beyond the standard BGA reflow range to maintain the stencil's aperture precision over time.