90x90 BGA Stencil Direct Heat – Intel i7/i5 11th Gen CPU Reballing BGA Reballing Stencil Axl Direct heating China Mainland

90x90 BGA Stencil Direct Heat – Intel i7/i5 11th Gen CPU Reballing

Direct heating / China Mainland
Sale price  $10.56 Regular price $12.49
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90x90 BGA Stencil Direct Heat – Intel i7/i5 11th Gen CPU Reballing BGA Reballing Stencil Axl Direct heating China Mainland

90x90 BGA Stencil Direct Heat – Intel i7/i5 11th Gen CPU Reballing

Sale price  $10.56 Regular price $12.49
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Ships FromChina Mainland

90×90mm Direct Heating BGA Reballing Stencil for Intel 11th Gen CPUs

Precision-engineered for professional motherboard repair technicians and electronics rework specialists, this 90×90mm direct heating BGA stencil is compatible with a wide range of Intel 11th Generation CPU models. Achieve clean, accurate solder ball placement every time without the need for a separate holder frame.

Compatible CPU Models

  • SRK02 – Intel Core i7-11390H
  • SRKSL – Intel Core i5-11320H
  • SRKSK – Intel Core i7-1195G7
  • SRKSB / SRKSC – Intel Core i5-1155G7
  • SRKSF – Intel Core i7-11375H

Key Features

  • Direct Heating Design: Apply heat directly through the stencil for faster, more efficient reballing — no separate holder required.
  • 90×90mm Size: Standard professional size for easy use with most BGA reballing stations and fixtures.
  • High-Precision Laser Cut: Each aperture is precisely laser-cut to match the exact ball pitch of supported Intel CPUs, ensuring accurate solder ball transfer.
  • Durable Stainless Steel Construction: Built to withstand repeated high-temperature use in professional repair environments.
  • Condition: Brand new.

Package Contents

  • 1 × 90×90mm BGA Reballing Stencil (Direct Heating)

Made in Mainland China.

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Frequently Asked Questions

Q: Which Intel CPU models is this BGA stencil compatible with?

A: This 90×90mm direct heating BGA reballing stencil supports Intel 11th Gen CPUs including the i7-11390H (SRK02), i5-11320H (SRKSL), i7-1195G7 (SRKSK), i5-1155G7 (SRKSB/SRKSC), and i7-11375H (SRKSF).

Q: What does "direct heating" mean for a BGA stencil?

A: A direct heating BGA stencil allows the hot air or infrared heat to be applied directly through the stencil onto the solder balls during reballing. This eliminates the need for a separate holder frame, making the reballing process faster and more straightforward for repair technicians.

Q: What size is this BGA reballing stencil?

A: The stencil measures 90×90mm, which is a standard professional size compatible with most BGA reballing stations and fixtures used in laptop and computer motherboard repair.

Q: How many stencils are included in the package?

A: Each order includes 1 × 90×90mm direct heating BGA reballing stencil.

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