{"product_id":"sam19-middle-layer-reballing-stencil-samsung-s23-s24-ultra-cpu-bga","title":"SAM19 Reballing Stencil for Samsung S23 \u0026 S24 Ultra CPU Chips","description":"\u003ch2\u003eSAM19 Middle Layer Reballing Stencil Template – Samsung S23 \u0026amp; S24 Ultra\u003c\/h2\u003e\n\u003cp\u003eDesigned for precision BGA reballing work, the \u003cstrong\u003eSAM19 Middle Layer Reballing Stencil Template\u003c\/strong\u003e is an essential tool for professional phone repair technicians and electronics hobbyists. Compatible with \u003cstrong\u003eSamsung Galaxy S23 Ultra and S24 Ultra\u003c\/strong\u003e chipsets — including the \u003cstrong\u003eSnapdragon 8550VS, 58080, WCN7851, P9481UK, and MPB02\u003c\/strong\u003e — this stencil ensures accurate solder ball placement every time.\u003c\/p\u003e\n\n\u003cp\u003eWhether you're reballing a CPU, modem IC, or power management chip, this middle-layer stencil provides the exact pitch alignment needed for a reliable, professional-grade repair. Made in Mainland China.\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eWide Chip Compatibility:\u003c\/strong\u003e Supports Snapdragon 8550VS, 58080, WCN7851, P9481UK, MPB02, and related ICs found in Samsung S23 Ultra and S24 Ultra boards\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eMiddle Layer Design:\u003c\/strong\u003e Precisely engineered stencil openings for accurate solder ball deposition on BGA pads\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eHigh-Quality Construction:\u003c\/strong\u003e Laser-cut stainless steel for consistent, repeatable results across multiple reballing jobs\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eProfessional Grade:\u003c\/strong\u003e Ideal for board-level repair shops, independent technicians, and advanced DIY repairers\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eNew Condition:\u003c\/strong\u003e Ships brand new, ready to use straight out of the package\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eQuantity:\u003c\/strong\u003e 1 stencil template per order\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eSpecifications\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eModel:\u003c\/strong\u003e SAM19\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eType:\u003c\/strong\u003e Middle Layer Reballing Stencil\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCompatible Chips:\u003c\/strong\u003e 8550VS, 58080, WCN7851, P9481UK, MPB02\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCompatible Devices:\u003c\/strong\u003e Samsung Galaxy S23 Ultra, S24 Ultra\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCondition:\u003c\/strong\u003e New\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCountry of Origin:\u003c\/strong\u003e Made in Mainland China\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eYou May Also Like\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge 0-10\/0-12\/0-25 Bar | DIY Tool\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/large-capacity-pencil-pen-bag-zipper-fabric-stationery-organizer\"\u003eLarge Capacity Pencil Pen Bag – Zipper Fabric Stationery Organizer\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/personal-protective-equipment\" target=\"_blank\" rel=\"noopener\"\u003eOSHA on personal protective equipment\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: Which Samsung chipsets is the SAM19 reballing stencil template compatible with?\u003c\/h4\u003e\n\u003cp\u003eA: The SAM19 middle layer reballing stencil is compatible with the Snapdragon 8550VS, 58080, WCN7851, P9481UK, and MPB02 chips found in the Samsung Galaxy S23 Ultra and S24 Ultra smartphones.\u003c\/p\u003e\n\u003ch4\u003eQ: What is a middle layer reballing stencil and how is it used?\u003c\/h4\u003e\n\u003cp\u003eA: A middle layer reballing stencil is a precision laser-cut template used during BGA (Ball Grid Array) chip reballing. It is placed over the chip's solder pads to hold solder balls in the correct position before reflowing, ensuring accurate and consistent solder joint formation during board-level phone repairs.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this stencil suitable for beginners or only professional technicians?\u003c\/h4\u003e\n\u003cp\u003eA: While the SAM19 stencil is primarily designed for professional phone repair technicians and board-level repair shops, advanced DIY repairers with BGA rework experience and the appropriate equipment (hot air station or reflow oven) can also use it successfully.\u003c\/p\u003e\n\u003ch4\u003eQ: How many stencils are included per order?\u003c\/h4\u003e\n\u003cp\u003eA: Each order includes 1 SAM19 middle layer reballing stencil template.\u003c\/p\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"Which Samsung chipsets is the SAM19 reballing stencil template compatible with?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"The SAM19 middle layer reballing stencil is compatible with the Snapdragon 8550VS, 58080, WCN7851, P9481UK, and MPB02 chips found in the Samsung Galaxy S23 Ultra and S24 Ultra smartphones.\"}}, {\"@type\": \"Question\", \"name\": \"What is a middle layer reballing stencil and how is it used?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"A middle layer reballing stencil is a precision laser-cut template used during BGA (Ball Grid Array) chip reballing. 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