{"product_id":"amaoe-bga-reballing-stencil-xiaomi-cpu-phone-repair-tool","title":"Amaoe BGA Reballing Stencil for Xiaomi CPU Phone Repair","description":"\u003ch2\u003eAmaoe BGA Reballing Stencil – Xiaomi CPU Series Phone Repair Tool\u003c\/h2\u003e\n\u003cp\u003eGet precision BGA reballing results with the \u003cstrong\u003eAmaoe BGA Reballing Stencil\u003c\/strong\u003e, engineered specifically for Xiaomi CPU chip repair across a wide range of popular series including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20, and K30 Pro. Whether you're a professional phone technician or an experienced DIY repair enthusiast, this stencil delivers the accuracy you need for clean, reliable solder ball placement every time.\u003c\/p\u003e\n\n\u003cp\u003e\u003cstrong\u003eMade in Mainland China.\u003c\/strong\u003e\u003c\/p\u003e\n\n\u003ch3\u003eKey Features\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\n\u003cstrong\u003eWide Compatibility:\u003c\/strong\u003e Designed for Xiaomi Mi series CPUs including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20, and K30 Pro models.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eHigh Precision Laser-Cut:\u003c\/strong\u003e Fine-pitch apertures ensure accurate solder ball alignment on CPU and IC chips for professional-grade reballing results.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eDurable Construction:\u003c\/strong\u003e Made from quality stainless steel for long-lasting performance and repeated use without warping or deformation.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eBrand: Amaoe\u003c\/strong\u003e – a trusted name in professional mobile phone repair tooling.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eCondition:\u003c\/strong\u003e Brand new.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eQuantity:\u003c\/strong\u003e 1 stencil per package.\u003c\/li\u003e\n  \u003cli\u003e\n\u003cstrong\u003eNo high-concern chemicals\u003c\/strong\u003e – safe for regular workshop use.\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eWho Is This For?\u003c\/h3\u003e\n\u003cp\u003eThis reballing stencil is ideal for:\u003c\/p\u003e\n\u003cul\u003e\n  \u003cli\u003eMobile phone repair technicians working on Xiaomi devices\u003c\/li\u003e\n  \u003cli\u003eElectronics repair shops handling BGA chip rework\u003c\/li\u003e\n  \u003cli\u003eHobbyist repairers tackling CPU-level soldering projects\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003ch3\u003eRelated Products You May Like\u003c\/h3\u003e\n\u003cul\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/electromagnetic-induction-tester-coil-motherboard-fault-detector\"\u003eElectromagnetic Induction Tester – Coil \u0026amp; Circuit Fault Detector\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/air-compressor-pressure-gauge-0-10-0-12-0-25-bar-hydraulic-diy\"\u003eAir Compressor Pressure Gauge 0-10\/0-12\/0-25 Bar | DIY Tool\u003c\/a\u003e\u003c\/li\u003e\n  \u003cli\u003e\u003ca href=\"\/products\/360-bicycle-chain-cleaner-tool-gear-cleaning-kit\"\u003e360° Bicycle Chain Cleaner Tool | Bike Gear Cleaning Kit\u003c\/a\u003e\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cp\u003eLearn more: \u003ca href=\"https:\/\/www.osha.gov\/hand-power-tools\" target=\"_blank\" rel=\"noopener\"\u003eOSHA guidance on hand and power tools\u003c\/a\u003e\u003c\/p\u003e\n\u003ch3\u003eFrequently Asked Questions\u003c\/h3\u003e\n\u003ch4\u003eQ: Which Xiaomi phone models is this BGA reballing stencil compatible with?\u003c\/h4\u003e\n\u003cp\u003eA: This Amaoe BGA reballing stencil is compatible with Xiaomi Mi series models including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20 Pro, and K30 Pro series CPUs. Always verify your specific chip footprint before use.\u003c\/p\u003e\n\u003ch4\u003eQ: What is a BGA reballing stencil used for?\u003c\/h4\u003e\n\u003cp\u003eA: A BGA (Ball Grid Array) reballing stencil is a precision tool used in electronics repair to accurately place solder balls onto CPU or IC chips after the original solder balls have been removed. It ensures proper alignment and consistent solder ball sizing for reliable chip reconnection to the circuit board.\u003c\/p\u003e\n\u003ch4\u003eQ: Is this stencil reusable?\u003c\/h4\u003e\n\u003cp\u003eA: Yes, this stencil is crafted from durable stainless steel, making it reusable across multiple reballing sessions without loss of precision or structural integrity.\u003c\/p\u003e\n\u003ch4\u003eQ: How many stencils are included in the package?\u003c\/h4\u003e\n\u003cp\u003eA: Each order includes 1 BGA reballing stencil. Please check the product variant selector for the specific model stencil you require.\u003c\/p\u003e\n\u003cscript type=\"application\/ld+json\"\u003e{\"@context\": \"https:\/\/schema.org\", \"@type\": \"FAQPage\", \"mainEntity\": [{\"@type\": \"Question\", \"name\": \"Which Xiaomi phone models is this BGA reballing stencil compatible with?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"This Amaoe BGA reballing stencil is compatible with Xiaomi Mi series models including Mi 2, 3, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, CC9, K20 Pro, and K30 Pro series CPUs. Always verify your specific chip footprint before use.\"}}, {\"@type\": \"Question\", \"name\": \"What is a BGA reballing stencil used for?\", \"acceptedAnswer\": {\"@type\": \"Answer\", \"text\": \"A BGA (Ball Grid Array) reballing stencil is a precision tool used in electronics repair to accurately place solder balls onto CPU or IC chips after the original solder balls have been removed. 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